Yanbo Zhang (张延博)

About Me

I am currently a Postdoctoral Fellow at the Hong Kong University of Science and Technology (HKUST). Prior to this, I was a Postdoctoral Research Fellow at Nanyang Technological University (NTU). I also worked as the AIoT scientist at BITS Pte. Ltd. (Singapore), a startup focused on intelligent IoT solutions. I received my Ph.D. in 2023 from the College of Computing and Data Science (CCDS), NTU, under the supervision of Professor Mo Li. Earlier, I earned my B.E. degree in 2017 from the Harbin Institute of Technology (HIT). For more details, please refer to my CV.

My research focuses on intelligent localization and sensing using wireless signals. By leveraging ambient signals—including different types of radio (e.g., Wi-Fi, millimeter wave) and acoustic waves—I develop methods to perceive and interpret environmental dynamics. I investigate the evolution of IoT technologies, particularly Wi-Fi, Bluetooth and LoRaWAN, to address practical industrial demands, emphasizing robust network reliability and optimized Quality of Service (QoS).

Research Interests

• Wireless sensing: Localization and tracking, vital signal monitroing, recognition and identification
• IoT communication: High reliability, Enhanced capacity, Dynamic QoS

News

• [October 2025] Our paper RippleSense is accepted to SenSys 2026. Congratulations to Andreas!
• [October 2025] Our measurement study on Sparklink Low Energy (SLE) is accepted to ACM TIOT. Congratulations to Boya and Zhenyu!
• [July 2025] Our paper LoRaMirror is accepted to IEEE TMC.
• [April 2025] I join CSE, HKUST as a Post-doctoral Fellow.
• [June 2024] Our paper won the Best Artifact Award at MobiSys 2024! Check out the artifact: .
• [May 2024] I join BITS as a Research Scientist.
• [May 2024] We are awarded all four badges from MobiSys Artifact Evaluation.
• [April 2024] Our paper about acoustic facial recognition is accepted to MobiSys 2024.

Publications

Services

Conference Organizers and Reviewers

• ACM MobiCom 2025 Competition Co-Chair
• IEEE ICPADS 2025
• IEEE ICPADS 2024
• ACM MobiCom 2023 Artifacts Evaluation

Journal Reviewers

• IEEE Transactions on Mobile Computing (TMC)
• IEEE Transactions on Wireless Communications (TWC)
• IEEE Open Journal of the Communications Society (OJ-COMS)
• ACM Transactions on Sensor Networks (TOSN)
• ACM Transactions on Internet of Things (TIOT)

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